《火花天龙剑 - OpenI》剧情简介：经由一系列的剖析和视察胖东来最终决议虽然他们的产品没有质量问题但为了体现对主顾的体贴决议无责任赔偿同时提醒宽大消耗者购置食物后应妥善生涯阻止因存放不当导致食物变质这一决议再次让胖东来的公众形象获得了一定的修复火花天龙剑 - OpenI至宝对一定是至宝不然又怎么会有这么大的威力电子专业单词手册2018-11-23 09:13·遇见尘都专业英语词汇电子业的红宝书1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 事情台电源4 Block Diagram 方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交织频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 焦点温度19 Disable 非使能无效禁用关断20 dominant pole 主极点21 Enable 使能有用启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction.Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 凌驾下面的规格使用可能引起永世的装备损害或装备故障建议不要事情在电特征表划定的参数规模以外25 Failling edge 下降沿26 figure of merit 品质因数27 float charge voltage 浮充电压28 flyback power stage 反驰式功率级29 forward voltage drop 前向压降30 free-running 自由运行31 Freewheel diode 续流二极管32 Full load 满负载33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human BodyModel 人体模式39 Hysteresis 滞回40 inrush current 涌入电流41 Inverting 反相42 jittery 颤抖43 Junction 结点44 Kelvin connection 开尔文毗连45 Lead Frame 引脚框架46 Lead Free 无铅47 level-shift 电平移动48 Line regulation 电源调解率49 load regulation 负载调解率50 Lot Number 批号51 Low Dropout 低压差52 Miller 密勒53 node 节点54 Non-Inverting 非反相55 novel 新颖的56 off state 关断状态57 Operating supply voltage 电源事情电压58 out drive stage 输出驱动级59 Out of Phase 异相60 Part Number 产品型号61 pass transistor pass transistor62 P-channel MOSFET P沟道MOSFET63 Phase margin 相位裕度64 Phase Node 开枢纽点65 portable electronics 便携式电子装备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲（Pulse by Pulse）74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振铃80 ripple current 纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through 直通同时导通85 stray inductances. 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold 阈值92 timing resistor 振荡电阻93 Top FET Top FET94 Trace 线路走线引线95 Transfer function 转达函数96 Trip Point 跳变点97 turns ratio 匝数比＝Np / Ns（初级匝数/次级匝数）98 Under Voltage Lock Out (UVLO) 欠压锁定99 Voltage Reference 电压参考100 voltage-second product 伏秒积101 zero-pole frequency compensation 零极点频率赔偿102 beat frequency 拍频103 one shots 单击电路104 scaling 缩放105 ESR 等效串联电阻106 Ground 地电位107 trimmed bandgap 平衡带隙108 dropout voltage 压差109 large bulk capacitance 大容量电容110 circuit breaker 断路器111 charge pump 电荷泵112 overshoot 过冲1） 元件装备三绕组变压器：three-column transformer ThrClnTrans双绕组变压器：double-column transformer DblClmnTrans电容器：Capacitor并联电容器：shunt capacitor电抗器：Reactor母线：Busbar输电线：TransmissionLine发电厂：power plant断路器：Breaker刀闸(隔脱离关)：Isolator分讨论：tap电念头：motor（2） 状态参数有功：active power无功：reactive power电流：current容量：capacity电压：voltage档位：tap position有功消耗：reactive loss无功消耗：active loss功率因数：power-factor功率：power功角：power-angle电压品级：voltage grade空载消耗：no-load loss铁损：iron loss铜损：copper loss空载电流：no-load current阻抗：impedance正序阻抗：positive sequence impedance负序阻抗：negative sequence impedance零序阻抗：zero sequence impedance电阻：resistor电抗：reactance电导：conductance电纳：susceptance无功负载：reactive load 或者QLoad有功负载: active load PLoad遥测：YC(telemetering)遥信：YX励磁电流(转子电流)：magnetizing current定子：stator功角：power-angle上限:upper limit下限：lower limit并列的：apposable高压: high voltage低压：low voltage中压：middle voltage电力系统power system发电机generator励磁 excitation励磁器excitor电压 voltage电流 current母线 bus变压器transformer升压变压器step-up transformer高压侧high side输电系统power transmission system输电线transmission line牢靠串联电容赔偿fixed series capacitor compensation稳固stability电压稳固voltage stability功角稳固angle stability暂态稳固transient stability电厂power plant能量运送power transfer交流 AC装机容量installed capacity电网power system落点drop point开关站switch station双回同杆并架double-circuit lines on the same tower变电站transformer substation赔偿度degree of compensation高抗high voltage shunt reactor无功赔偿reactive power compensation故障 fault调理 regulation裕度magin三相故障three phase fault故障切除时间fault clearing time极限切除时间critical clearing time切机generator triping高顶值high limited value强行励磁reinforced excitation线路赔偿器LDC(line drop compensation)机端generator terminal静态static (state)动态 dynamic (state)单机无限大系统one machine - infinity bus system机端电压控制AVR电抗reactance电阻resistance功角power angle有功（功率） active power无功（功率） reactive power功率因数power factor无功电流reactive current下降特征droop characteristics斜率slope额定 rating变比 ratio参考值reference value电压互感器PT分讨论tap下降率droop rate仿真剖析simulation analysis转达函数transfer function框图block diagram受端 receive-side裕度margin同步synchronization失去同步loss of synchronization阻尼damping摇晃 swing�；ざ下菲鱟ircuit breaker电阻：resistance电抗：reactance阻抗：impedance电导：conductance电纳：susceptance导纳：admittance电感：inductance电容: capacitancecoupling 耦合intermittent 周期的dislocation 错位propeller 螺旋桨switchgear 配电装置dispersion 差量flange 法兰盘dielectric 介电的binder 胶合剂alignment 定位elastomer 合成橡胶corollary 一定的效果rabbet 插槽vent 透风孔subtle 敏感的gearbox 变速箱plate 电镀crucial 决议性的flexible 柔性的technics 工艺ultimate 最终的resilience 弹性vendor 自动售货机partition 分类rigid 刚性的prototype 样机diagram 特征曲线interfere 干预compatible 兼容的simulation 模拟clutch 离合器refinement 精加工fixture 夹具torque 扭矩responsive 敏感的tensile 拉伸cushion 减震器rib 肋strength 强度packing 包装metallized 金属化stress 应力mitigate 减轻trade off 折衷计划yield 屈伸line shaft 中心轴matrix 母体inherent 固有的spindle 主轴aperture 孔径conformance 顺应性axle 心轴turbulence 扰动specification 规范semipermanent 半永世性的enclosure 机壳specialization 规范化bolt 螺栓oscillation 振幅calling 职业nut 螺母anneal 退火vitalize 引发screw 螺丝polymer 聚合体revelation 展现fastner 紧固件bind 凝固dissemination 分发rivit 铆钉mount 支架booster 推进器hub 轴套distortion 变形contractual 左券的coaxial 同心的module �？関erdict 裁决crank 曲柄slide 滑块malfunction 故障inertia 惰性medium 介质allegedly 假定active 活性的dissipation 消耗controversy 辩说lubrication 润滑assembly 总装dictate 支配graphite 石墨encapsulate 封装incumbent 义禁止辞的derivative 派生物adhesive 粘合剂validation 使生效contaminate 沾染turbine 涡轮procurement 收购asperity 粗糙bearing 支持架mortality 失败率metalworking 金属加工isostatic 平衡的shed light on 剖析viscous 粘稠的osculate 接触adversely 有害的grinding 研磨imperative 强制的consistency 一连性corrosin 侵蚀lattice 晶格fitness 顺应性flush 冲洗fracture 断裂warrant 包管inhibitor 防腐剂diffusivity 扩散率turning 车工dispersant 疏散剂vice versa 反之亦然ways 导轨deteriorate 降低tribological 摩擦的hybrid 混淆物neutralize 平衡screen 屏障ID=inside diameterpulley 滑轮exclusion 阻遏OD=outside diameterhydraulic 液压的insulation 绝缘reciprocate 往复运动delicate 细密的elaborate 加工dress 精整dampen 阻尼incontrovertible 无可争议的by and large 概略上pivotal 中枢的luminous 发光的plastic 塑胶utilitarian 功利主义out of round 失园organic 有机的grass root 下层premature 过早的film 薄膜state-of-the -art 手艺生长水平guard 防护罩polyester 聚酯blade 托板permeate 渗入epoxy 环氧的carrier 载体spillage 溢出polypropylene 聚丙烯chuck 卡盘erosion 浸蚀photoconductive 光敏的infeed 横向进给routine 程序miniaturization 小型化lapping 抛光postprocess 后置处置惩罚asynchronism 异步milling 洗削solder-bump 焊点synchronization 同步speciality 专业grid 栅格respond 响应stroke 行程impedance 阻抗feedback 反响attachment 备件approximately 约莫aberrance 畸变tapered 楔形的purported 听说steady 稳态的casting 铸件consumable 消耗品dynamic 动态的index 换档inductance 电感transient 瞬态的stop 挡块capacitance 电容coordinate 坐标contour 轮廓resistance 电容curve 曲线machine center 加工中心audion 三极管diagram 特征曲线capitalize 投资diode 二极管history 关系曲线potentiometer 电位器transistor 晶体管gradient 斜率know-how 实践知识choker 扼流圈parabola 抛物线potted 封装的filter 滤波器root 根mechatronics 机电一体化transformer 变压器eigenvalue 特征值stem from 起源于fuse 包管丝function 函数rule-based 基于规则的annular core 磁环vector 向量consolidation 牢靠radiator 散热器reciprocal 倒数energize 引发regulator 稳压器virtual value 有用值synchronous 同时爆发bobbin 骨架square root 平方根socket 插孔tape 胶带cube 立方polarity 极性ceramic capacitor 瓷片电容integral 积分armature 电枢electrolytic C 电解电容differential 微分installment 分期付款self-tapping screw 自攻螺丝hisgram 直方图lobe 凸起footprint 封装ratio 比率plunge 钻入resin 松香grade down 成比例降低servo 伺服机构solderability 可焊性proportion 比例dedicated 专用的shock 机械攻击inverse ratio 反比interpolation 插补endurance 耐久性direct ratio 正比compensation 校正initial value 初始值plus 加upload 加载flashing 飞弧subtract 减overload 过载canned 如出一辙的multiply 乘lightload 轻载lot 抽签divide 除stagger 交织排列parallel 并联impedance 阻抗traverse 横向in series 串联damp 阻尼longitudinal 纵向的equivalent 等效的reactance 电抗latitudinal 横向的terminal 终端admittance 导纳restrain 约束creep 蠕动susceptance 电纳square 平方Hyperlink 超等毗连spring 触发memo 备忘录wastage 消耗presentation 陈述principle 原理binder 打包planer 刨床source program 源程序Client-Server Model客户机server 服务器table 表query 盘问form 表单report 报表macro 宏module �？閒ield 字段record 纪录printed circuit 印制电路printed wiring 印制线路printed board 印制板printed circuit board 印制板电路printed wiring board 印制线路板printed component 印制元件printed contact 印制接点printed board assembly 印制板装配board 板rigid printed board 刚性印制板flexible printed circuit 挠性印制电路flexible printed wiring 挠性印制线路flush printed board 齐平印制板metal core printed board 金属芯印制板metal base printed board 金属基印制板mulit-wiring printed board 多重布线印制板molded circuit board 模塑电路板discrete wiring board 散线印制板micro wire board 微线印制板buile-up printed board 积层印制板surface laminar circuit 外貌层合电路板B2it printed board 埋入凸块连印制板chip on board 载芯片板buried resistance board 埋电阻板mother board 母板daughter board 子板backplane 背板bare board 裸板copper-invar-copper board 键盘板夹心板dynamic flex board 动态挠性板static flex board 静态挠性板break-away planel 可断拼板cable 电缆flexible flat cable (FFC) 挠性扁平电缆membrane switch 薄膜开关hybrid circuit 混淆电路thick film 厚膜thick film circuit 厚膜电路thin film 薄膜thin film hybrid circuit 薄膜混淆电路interconnection 互连conductor trace line 导线flush conductor 齐平导线transmission line 传输线crossover 跨交edge-board contact 板边插头stiffener 增强板substrate 基底real estate 基板面conductor side 导线面component side 元件面solder side 焊接面printing 印制grid 网格pattern 图形conductive pattern 导电图形non-conductive pattern 非导电图形legend 字符mark 标记base material 基材laminate 层压板metal-clad bade material 覆金属箔基材copper-clad laminate (CCL) 覆铜箔层压板composite laminate 复合层压板thin laminate 薄层压板basis material 基体质料prepreg 预浸质料bonding sheet 粘结片preimpregnated bonding sheer 预浸粘结片epoxy glass substrate 环氧玻璃基板mass lamination panel 预制内层覆箔板core material 内层芯板bonding layer 粘结层film adhesive 粘结膜unsupported adhesive film 无支持胶粘剂膜cover layer (cover lay) 笼罩层stiffener material 增强板材copper-clad surface 铜箔面foil removal surface 去铜箔面unclad laminate surface 层压板面base film surface 基膜面adhesive faec 胶粘剂面plate finish 原始光洁面matt finish 粗面length wise direction 纵向cross wise direction 模向cut to size panel 剪切板ultra thin laminate 超薄型层压板A-stage resin A阶树脂B-stage resin B阶树脂C-stage resin C阶树脂epoxy resin 环氧树脂phenolic resin 酚醛树脂polyester resin 聚酯树脂polyimide resin 聚酰亚胺树脂bismaleimide-triazine resin 双马来酰亚胺三嗪树脂acrylic resin 丙烯酸树脂melamine formaldehyde resin 三聚氰胺甲醛树脂polyfunctional epoxy resin 多官能环氧树脂brominated epoxy resin 溴化环氧树脂epoxy novolac 环氧酚醛fluroresin 氟树脂silicone resin 硅树脂silane 硅烷polymer 聚合物amorphous polymer 无定形聚合物crystalline polamer 结晶征象dimorphism 双晶征象copolymer 共聚物synthetic 合成树脂thermosetting resin 热固性树脂thermoplastic resin 热塑性树脂photosensitive resin 感光性树脂epoxy value 环氧值dicyandiamide 双氰胺binder 粘结剂adesive 胶粘剂curing agent 固化剂flame retardant 阻燃剂opaquer 遮光剂plasticizers 增塑剂unsatuiated polyester 不饱和聚酯polyester 聚酯薄膜polyimide film (PI) 聚酰亚胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material 增强质料glass fiber 玻璃纤维E-glass fibre E玻璃纤维D-glass fibre D玻璃纤维S-glass fibre S玻璃纤维glass fabric 玻璃布non-woven fabric 非织布glass mats 玻璃纤维垫yarn 纱线filament 单丝strand 绞股weft yarn 纬纱warp yarn 经纱denier 但尼尔warp-wise 经向thread count 织物经纬密度weave structure 织物组织plain structure 平纹组织grey fabric 坏布woven scrim 稀松织物bow of weave 弓纬end missing 断经mis-picks 缺纬bias 纬斜crease 折痕waviness 云织fish eye 鱼眼feather length 毛圈长mark 厚薄段split 裂痕twist of yarn 捻度size content 浸润剂含量size residue 浸润剂残留量finish level 处置惩罚剂含量size 浸润剂couplint agent 偶联剂finished fabric 处置惩罚织物polyarmide fiber 聚酰胺纤维aromatic polyamide paper 聚芳酰胺纤维纸breaking length 断裂长height of capillary rise 吸水高度wet strength retention 湿强度保存率whitenness 白度ceramics 陶瓷conductive foil 导电箔copper foil 铜箔rolled copper foil 压延铜箔annealed copper foil 退火铜箔thin copper foil 薄铜箔adhesive coated foil 涂胶铜箔resin coated copper foil 涂胶脂铜箔composite metallic material 复合金属箔carrier foil 载体箔invar 殷瓦foil profile 箔（剖面）轮廓shiny side 光面matte side 粗糙面treated side 处置惩罚面stain proofing 防锈处置惩罚double treated foil 双面处置惩罚铜箔shematic diagram 原理图logic diagram 逻辑图printed wire layout 印制线路布设master drawing 布设总图computer aided drawing 盘算机辅助制图computer controlled display 盘算机控制显示placement 结构routing 布线layout 布图设计rerouting 重布simulation 模拟logic simulation 逻辑模拟circit simulation 电路模拟timing simulation 时序模拟modularization �？榛痩ayout effeciency 布线完成率MDF databse 机械形貌名堂数据库design database 设计数据库design origin 设计原点optimization (design) 优化（设计）predominant axis 供设计优化坐标轴table origin 表格原点mirroring 镜像drive file 驱动文件intermediate file 中心文件manufacturing documentation 制造文件queue support database 行列支持数据库component positioning 元件安顿graphics dispaly 图形显示scaling factor 比例因子scan filling 扫描填充rectangle filling 矩形填充region filling 填充域physical design 实体设计logic design 逻辑设计logic circuit 逻辑电路hierarchical design 条理设计top-down design 自顶向下设计bottom-up design 自底向上设计net 线网digitzing 数字化design rule checking 设计规则检查router (CAD) 走（布）线器net list 网络表subnet 子线网objective function 目的函数post design processing (PDP) 设计后处置惩罚interactive drawing design 交互式制图设计cost metrix 用度矩阵engineering drawing 工程图block diagram 方块框图moze 迷宫component density 元件密度traveling salesman problem 回售货员问题degrees freedom 自由度out going degree 入度incoming degree 出度manhatton distance 曼哈顿距离euclidean distance 欧几里德距离network 网络array 阵列segment 段logic 逻辑logic design automation 逻辑设计自动化separated time 分线separated layer 分层definite sequence 定顺序conduction (track) 导线（通道）conductor width 导线（体）宽度conductor spacing 导线距离conductor layer 导线层conductor line/space 导线宽度/间距conductor layer No.1 第一导线层round pad 圆形盘square pad 方形盘diamond pad 菱形盘oblong pad 长方形焊盘bullet pad 子弹形盘teardrop pad 泪滴盘snowman pad 雪人盘V-shaped pad V形盘annular pad 环形盘non-circular pad 非圆形盘isolation pad 隔离盘monfunctional pad 非功效毗连盘offset land 偏置毗连盘back-bard land 腹（背）裸盘anchoring spaur 盘址land pattern 毗连盘图形land grid array 毗连盘网格阵列annular ring 孔环component hole 元件孔mounting hole 装置孔supported hole 支持孔unsupported hole 非支持孔via 导通孔plated through hole (PTH) 镀通孔access hole 余隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via 埋,盲孔any layer inner via hole 恣意层内部导通孔all drilled hole 所有钻孔toaling hole 定位孔landless hole 无毗连盘孔interstitial hole 中心孔landless via hole 无毗连盘导通孔pilot hole 指导孔terminal clearomee hole 端接全隙孔dimensioned hole 准尺寸孔via-in-pad 在毗连盘中导通孔hole location 孔位hole density 孔密度hole pattern 孔图drill drawing 钻孔图assembly drawing 装配图datum referan 参考基准printed circuit 印制电路printed wiring 印制线路printed board 印制板printed circuit board 印制板电路printed wiring board 印制线路板printed component 印制元件printed contact 印制接点printed board assembly 印制板装配board 板rigid printed board 刚性印制板flexible printed circuit 挠性印制电路flexible printed wiring 挠性印制线路flush printed board 齐平印制板metal core printed board 金属芯印制板metal base printed board 金属基印制板mulit-wiring printed board 多重布线印制板molded circuit board 模塑电路板discrete wiring board 散线印制板micro wire board 微线印制板buile-up printed board 积层印制板surface laminar circuit 外貌层合电路板B2it printed board 埋入凸块连印制板chip on board 载芯片板buried resistance board 埋电阻板mother board 母板daughter board 子板backplane 背板bare board 裸板copper-invar-copper board 键盘板夹心板dynamic flex board 动态挠性板static flex board 静态挠性板break-away planel 可断拼板cable 电缆flexible flat cable (FFC) 挠性扁平电缆membrane switch 薄膜开关hybrid circuit 混淆电路thick film 厚膜thick film circuit 厚膜电路thin film 薄膜thin film hybrid circuit 薄膜混淆电路interconnection 互连conductor trace line 导线flush conductor 齐平导线transmission line 传输线crossover 跨交edge-board contact 板边插头stiffener 增强板substrate 基底real estate 基板面conductor side 导线面component side 元件面solder side 焊接面printing 印制grid 网格pattern 图形conductive pattern 导电图形non-conductive pattern 非导电图形legend 字符mark 标记base material 基材laminate 层压板metal-clad bade material 覆金属箔基材copper-clad laminate (CCL) 覆铜箔层压板composite laminate 复合层压板thin laminate 薄层压板basis material 基体质料prepreg 预浸质料bonding sheet 粘结片preimpregnated bonding sheer 预浸粘结片epoxy glass substrate 环氧玻璃基板mass lamination panel 预制内层覆箔板core material 内层芯板bonding layer 粘结层film adhesive 粘结膜unsupported adhesive film 无支持胶粘剂膜cover layer (cover lay) 笼罩层stiffener material 增强板材copper-clad surface 铜箔面foil removal surface 去铜箔面unclad laminate surface 层压板面base film surface 基膜面adhesive faec 胶粘剂面plate finish 原始光洁面matt finish 粗面length wise direction 纵向cross wise direction 模向cut to size panel 剪切板ultra thin laminate 超薄型层压板A-stage resin A阶树脂B-stage resin B阶树脂C-stage resin C阶树脂epoxy resin 环氧树脂phenolic resin 酚醛树脂polyester resin 聚酯树脂polyimide resin 聚酰亚胺树脂bismaleimide-triazine resin 双马来酰亚胺三嗪树脂acrylic resin 丙烯酸树脂melamine formaldehyde resin 三聚氰胺甲醛树脂polyfunctional epoxy resin 多官能环氧树脂brominated epoxy resin 溴化环氧树脂epoxy novolac 环氧酚醛fluroresin 氟树脂silicone resin 硅树脂silane 硅烷polymer 聚合物amorphous polymer 无定形聚合物crystalline polamer 结晶征象dimorphism 双晶征象copolymer 共聚物synthetic 合成树脂thermosetting resin 热固性树脂thermoplastic resin 热塑性树脂photosensitive resin 感光性树脂epoxy value 环氧值dicyandiamide 双氰胺binder 粘结剂adesive 胶粘剂curing agent 固化剂flame retardant 阻燃剂opaquer 遮光剂plasticizers 增塑剂unsatuiated polyester 不饱和聚酯polyester 聚酯薄膜polyimide film (PI) 聚酰亚胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material 增强质料glass fiber 玻璃纤维E-glass fibre E玻璃纤维D-glass fibre D玻璃纤维S-glass fibre S玻璃纤维glass fabric 玻璃布non-woven fabric 非织布glass mats 玻璃纤维垫yarn 纱线filament 单丝strand 绞股weft yarn 纬纱warp yarn 经纱denier 但尼尔warp-wise 经向thread count 织物经纬密度weave structure 织物组织plain structure 平纹组织grey fabric 坏布woven scrim 稀松织物bow of weave 弓纬end missing 断经mis-picks 缺纬bias 纬斜crease 折痕waviness 云织fish eye 鱼眼feather length 毛圈长mark 厚薄段split 裂痕twist of yarn 捻度size content 浸润剂含量size residue 浸润剂残留量finish level 处置惩罚剂含量size 浸润剂couplint agent 偶联剂finished fabric 处置惩罚织物polyarmide fiber 聚酰胺纤维aromatic polyamide paper 聚芳酰胺纤维纸breaking length 断裂长height of capillary rise 吸水高度wet strength retention 湿强度保存率whitenness 白度ceramics 陶瓷conductive foil 导电箔copper foil 铜箔rolled copper foil 压延铜箔annealed copper foil 退火铜箔thin copper foil 薄铜箔adhesive coated foil 涂胶铜箔resin coated copper foil 涂胶脂铜箔composite metallic material 复合金属箔carrier foil 载体箔invar 殷瓦foil profile 箔（剖面）轮廓shiny side 光面matte side 粗糙面treated side 处置惩罚面stain proofing 防锈处置惩罚double treated foil 双面处置惩罚铜箔shematic diagram 原理图logic diagram 逻辑图printed wire layout 印制线路布设master drawing 布设总图computer aided drawing 盘算机辅助制图computer controlled display 盘算机控制显示placement 结构routing 布线layout 布图设计rerouting 重布simulation 模拟logic simulation 逻辑模拟circit simulation 电路模拟timing simulation 时序模拟modularization �？榛痩ayout effeciency 布线完成率MDF databse 机械形貌名堂数据库design database 设计数据库design origin 设计原点optimization (design) 优化（设计）predominant axis 供设计优化坐标轴table origin 表格原点mirroring 镜像drive file 驱动文件intermediate file 中心文件manufacturing documentation 制造文件queue support database 行列支持数据库component positioning 元件安顿graphics dispaly 图形显示scaling factor 比例因子scan filling 扫描填充rectangle filling 矩形填充region filling 填充域physical design 实体设计logic design 逻辑设计logic circuit 逻辑电路hierarchical design 条理设计top-down design 自顶向下设计bottom-up design 自底向上设计net 线网digitzing 数字化design rule checking 设计规则检查router (CAD) 走（布）线器net list 网络表subnet 子线网objective function 目的函数post design processing (PDP) 设计后处置惩罚interactive drawing design 交互式制图设计cost metrix 用度矩阵engineering drawing 工程图block diagram 方块框图moze 迷宫component density 元件密度traveling salesman problem 回售货员问题degrees freedom 自由度out going degree 入度incoming degree 出度manhatton distance 曼哈顿距离euclidean distance 欧几里德距离network 网络array 阵列segment 段logic 逻辑logic design automation 逻辑设计自动化separated time 分线separated layer 分层definite sequence 定顺序conduction (track) 导线（通道）conductor width 导线（体）宽度conductor spacing 导线距离conductor layer 导线层conductor line/space 导线宽度/间距conductor layer No.1 第一导线层round pad 圆形盘square pad 方形盘diamond pad 菱形盘oblong pad 长方形焊盘bullet pad 子弹形盘teardrop pad 泪滴盘snowman pad 雪人盘V-shaped pad V形盘annular pad 环形盘non-circular pad 非圆形盘isolation pad 隔离盘monfunctional pad 非功效毗连盘offset land 偏置毗连盘back-bard land 腹（背）裸盘anchoring spaur 盘址land pattern 毗连盘图形land grid array 毗连盘网格阵列annular ring 孔环component hole 元件孔mounting hole 装置孔supported hole 支持孔unsupported hole 非支持孔via 导通孔plated through hole (PTH) 镀通孔access hole 余隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via 埋,盲孔any layer inner via hole 恣意层内部导通孔all drilled hole 所有钻孔toaling hole 定位孔landless hole 无毗连盘孔interstitial hole 中心孔landless via hole 无毗连盘导通孔pilot hole 指导孔terminal clearomee hole 端接全隙孔dimensioned hole 准尺寸孔via-in-pad 在毗连盘中导通孔hole location 孔位hole density 孔密度hole pattern 孔图drill drawing 钻孔图assembly drawing 装配图datum referan 参考基准一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、外貌层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混淆电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混淆电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标记：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体质料：basis material13、预浸质料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支持胶粘剂膜：unsupported adhesive film27、笼罩层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的质料1、A 阶树脂：A-stage resin2、B 阶树脂：B-stage resin3、C 阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶征象：crystalline polamer20、双晶征象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(FEP)40、增强质料：reinforcing material41、玻璃纤维：glass fiber42、E 玻璃纤维：E-glass fibre43、D 玻璃纤维：D-glass fibre44、S 玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂痕：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处置惩罚剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处置惩罚织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保存率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处置惩罚面：treated side103、防锈处置惩罚：stain proofing104、双面处置惩罚铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、盘算机辅助设计：computer-aided design.(CAD)7、盘算机辅助制造：computer-aided manufacturing.(CAM)8、盘算机集成制造：computer integrat manufacturing.(CIM)9、盘算机辅助工程：computer-aided engineering.(CAE)10、盘算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、盘算机辅助制图：computer aided drawing15、盘算机控制显示：computer controlled display .(CCD)16、结构：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、�？榛簃odularization25、布线完成率：layout effeciency26、机械形貌名堂：machine descriptionm format .(MDF)27、机械形貌名堂数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中心文件：intermediate file36、制造文件：manufacturing documentation37、行列支持数据库：queue support database38、元件安顿：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、条理设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、盘算机辅助电路剖析：computer-aided circuit analysis56、子线网：subnet57、目的函数：objective function58、设计后处置惩罚：post design processing (PDP)59、交互式制图设计：interactive drawing design60、用度矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V 形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功效毗连盘：monfunctional pad19、偏置毗连盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、毗连盘图形：land pattern23、毗连盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、装置孔：mounting hole27、支持孔：supported hole28、非支持孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、恣意层内部导通孔：any layer inner via hole (ALIVH)36、所有钻孔：all drilled hole37、定位孔：toaling hole38、无毗连盘孔：landless hole39、中心孔：interstitial hole40、无毗连盘导通孔：landless via hole41、指导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准外貌间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在毗连盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan
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